Designing and manufacturing surface mount assemblies requires a unique technology. Known as Surface Mount Technology, or SMT, this method is what engineers use to produce electronic circuits found in components placed or mounted directly onto the surface of printed circuit boards. Once completed, the product is known as a Surface Mount Device, or SMD.
Today, the through hole technology is often replaced with SMT. Instead of fitting components with wire leads that go through holes in the circuit board, most manufacturers use the more updated process. Keep in mind that for surface mount assemblies, experts still use both technologies, but the through-hole process is typically saved for components deemed non-suitable for surface mounting, including heat-sinked power semiconductors and large transformers.
Curious to read more? View original source: http://www.starengineeringinc.com/technology-for-surface-mount-assemblies/
Contact Details:
Star Engineering, Inc1 Vaillancourt Drive, North Attleboro,Massachusetts 2763Phone No: 508-316-1492Email: info@starengineeringinc.com
