Showing posts with label through hole technology. Show all posts
Showing posts with label through hole technology. Show all posts

Monday, November 27, 2017

Some Common Differences in Surface Mounting and Through Hole Technology

There are a number of key differences between surface mounting and through hole technology. Understanding these differences will make it easier for you to not only identify the right company to work on your project but also know which of the two processes is best.
Surface Mount Technology (SMT) versus Through Hole
SMT technology has become increasing popular over the past several years. In fact, it has now replaced the more conventional through hole technology for many applications. However, that does not mean that through hole drilling is obsolete since there are some situations in which this is the better technology.
For a long time, thru holes were commonly used to construct virtually all printed circuit boards (PCBs). With this technique, holes are drilled on PCBs through which leads of electrical components are inserted. These leads are then soldered to pads located on the opposite side of the board. Although this remains an extremely reliable method for securing leads to PCBs, the act of drilling additional holes makes this a more expensive method compared to SMT.

Contact Details:
Star Engineering, Inc, 1 Vaillancourt Drive, North Attleboro, Massachusetts 02763 Phone No: 508-316-1492 Email: info@starengineeringinc.com

Thursday, April 27, 2017

Technology for Surface Mount Assemblies

Designing and manufacturing surface mount assemblies requires a unique technology. Known as Surface Mount Technology, or SMT, this method is what engineers use to produce electronic circuits found in components placed or mounted directly onto the surface of printed circuit boards. Once completed, the product is known as a Surface Mount Device, or SMD.
Today, the through hole technology is often replaced with SMT. Instead of fitting components with wire leads that go through holes in the circuit board, most manufacturers use the more updated process. Keep in mind that for surface mount assemblies, experts still use both technologies, but the through-hole process is typically saved for components deemed non-suitable for surface mounting, including heat-sinked power semiconductors and large transformers.
Contact Details:
Star Engineering, Inc1 Vaillancourt Drive, North Attleboro,Massachusetts 2763Phone No: 508-316-1492Email: info@starengineeringinc.com